Rigao Electronics Co, . Ltd is an experienced PCB and PCBA manufacturer in Shenzhen, China. After several years' developing and improving, our company establishes our main business in three principal areas-Printed Circuit Boards, PCB Assembly and Components Procurement. From prototype to mass production, we are able to gurantee a complete service with technical back up, offering a cost advantage and continuity of supply.
For making PCBA, customer just need to provide us with Gerber file and bill of material. Components procurement is one of the featured service we can provide. IC, battery, fuse, LCD, transformer, LED Diode, connector, sensor, we could purchase all these electronic parts to our customers.
Our PCBA capability and services: SMT/THT/DIP.
1. Component Purchasing Service
2. SMT assembly and Through hole components insertion
3. IC pre-programming / Burning on-line
4. Function testing as requested
5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc)
6. Packing design
1. Singlesided PCB, double side PCB & multilayer PCB with competitive price, good quality and excellent service.
2. FR-4, FR-4 High TG, CEM-1, CEM-3, Aluminum base material.
3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment.
4. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
5. Quantities range from prototype to medium and batch production.
- Contract Manufacturing PCB and PCBA
- Engineering Services
- PCB Design & Assembly and copy service
- Prototyping PCB and PCBA
- Components purchasing
- Plastics and Molds
- Fast turn around PCB and PCBAPCB&PCBA Capability:
|Material||FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, PTFE, TACONIC, F4B, ARLON, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc.|
|ayers (GERBER FILE)||Mass production: 2~58 layers & Prototyping run: 64 layers|
|Board Thickness||0.2mm - 7mm|
|Copper Thickness||1/2 oz - 14 oz|
|Surface Treatment||HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, |
ENEPIG, Gold Finger
|Data File Format||Gerber file, Protel, OrCAD, PADS2000 , Altium, Powerpcb , ODB++, EDA,|
|Min. Hole Size||Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)|
|Hole Size Tolerance||+/-0.05mm (2 mil)|
|Min. Line Width and Spacing||0.1mm (4 mil)|
|Min. Solder Mask Clearance||0.076mm (3mil)|
|Min. Annular Ring||0.076mm (3mil)|
|Max. Panel Size||1150mm × 560mm|
|Max. Copper Thickness||UL certificated: 6.0 OZ & Prototyping run: 12OZ|
|Profile and V-Cut||V-Cut, Jump V-Cut, CNC V-Cut CNC-Routing, Stamping and Beveling|
|Special Process||Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.|
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|Type of PCB Assembly||SMT, Thru-hole,COB|
|SMT||Position accuracy:20 um|
|Components size:0.4×0.2mm(01005) -130×79mm,Flip-CHIP,QFP,BGA,POP|
|Max. component height::25mm|
|Max. PCB size:680×500mm|
|Min. PCB size:no limited|
|PCB thickness:0.3 to 7mm|
|Wave Solder||Max. PCB width:450mm|
|Min. PCB width: no limited|
|Component height:Top 120mm/Bot 15mm|
|Sweat-Solder||Metal type :part, whole, inlay, sidestep|
|Metal material:Copper , Aluminum|
|Surface Finish:plating Au, plating sliver , plating Sn|
|Air bladder rate:less than20%|
|Supporting:||Software burning and Function Testing|
| Testing||X-RAY Inspection & AOI Test, ICT,Probe flying,burn-in,function test,temperature cycling|
|File Fomat||Bill of Materials,Gerber Files, Pick-N-Place File (XYRS),PCB,Altium, EDA etc|
Parameter of multilayer pcb fabrication and assembly:
|Inner Packing||Vacuum Package|