Multilayer Buried Blind Via HDI PCB with SMT Assembly

FOB Price: US $0.8 / Piece
Min. Order: 1 Piece
Min. Order FOB Price
1 Piece US $0.8/ Piece
Port: Shenzhen, China
Production Capacity: 50000000PCS/Year
Payment Terms: L/C, T/T, D/P, Western Union, Paypal, Money Gram
Multilayer Buried Blind Via HDI PCB with SMT Assembly

Basic Info

Product Description

Customer Question & Answer

  • Model NO.: Rigao PCB - 002
  • Dielectric: FR-4
  • Application: Communication
  • Mechanical Rigid: Rigid
  • Base Material: Copper
  • Brand: JC
  • Board Thickness: 0.2~6.0mm
  • Engineering Support: Yes
  • Package: Antistatic Bag
  • Delivery Time: 3~7 Days for PCB Run
  • Trademark: Shenzhen Rigao Electronics Co, . Ltd.
  • Specification: CE, RoHS, TS16949, ISO9001
  • HS Code: 8534001000
  • Type: Rigid Circuit Board
  • Material: Fiberglass Epoxy Resin + Polyimide Resin
  • Flame Retardant Properties: HB
  • Processing Technology: Electrolytic Foil
  • Insulation Materials: Epoxy Resin
  • Size: 650*650mm
  • Copper Thickness: 0.5~6 Oz
  • PCB Design Services: Yes
  • Prototypes Run: Yes
  • Surface Finishing: HASL Lead Free, Enig, or Immersion Silver
  • Transport Package: Inner Vacuum Outer Carton
  • Origin: Shenzhen, Guangdong
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Mr. Alex Su

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