Multilayer Buried Blind Via HDI PCB with SMT Assembly

FOB Price: US $0.8 / Piece
Min. Order: 1 Piece
Min. Order FOB Price
1 Piece US $0.8/ Piece
Port: Shenzhen, China
Production Capacity: 50000000PCS/Year
Payment Terms: L/C, T/T, D/P, Western Union, Paypal, Money Gram
Multilayer Buried Blind Via HDI PCB with SMT Assembly

Basic Info

Product Description

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Model NO.
Rigao PCB - 002
Type
Rigid Circuit Board
Dielectric
Material
Fiberglass Epoxy Resin + Polyimide Resin
Application
Communication
Flame Retardant Properties
HB
Mechanical Rigid
Processing Technology
Base Material
Insulation Materials
Brand
JC
Size
650*650mm
Board Thickness
0.2~6.0mm
Copper Thickness
0.5~6 Oz
Engineering Support
Yes
PCB Design Services
Yes
Package
Antistatic Bag
Prototypes Run
Yes
Delivery Time
3~7 Days for PCB Run
Surface Finishing
HASL Lead Free, Enig, or Immersion Silver
Trademark
Shenzhen Rigao Electronics Co, . Ltd.
Transport Package
Inner Vacuum Outer Carton
Specification
CE, RoHS, TS16949, ISO9001
Origin
Shenzhen, Guangdong
HS Code
8534001000
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